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With a focus on technology and innovation, we provide the most up-to-date coverage on the latest products, services, and developments. We stay connected to the ever-evolving world of tech, offering news, analysis, trends, and reports with weekly updates – all sorted by our experts.

Turning Cold Forming Machine to Warm Forming: Using a Thermal Digital Twin to De-Risk a Forming Machine Upgrade

Turning Cold Forming Machine to Warm Forming: Using a Thermal Digital Twin to De-Risk a Forming Machine Upgrade

Turning Cold Forming Machine to Warm Forming: Using a Thermal Digital Twin to De-Risk a Forming Machine Upgrade The challenge Cold forming machines are workhorses of precision manufacturing, reliable, well understood, and tuned over years of production. But some parts and materials perform better when formed at an elevated temperature rather than at room temperature. The catch is that converting...

MEET OUR TEAM- ENGINEERING STORIES FROM THE INSIDE. FEATURING Asmaa Zaki, Software & System Test Engineer

MEET OUR TEAM- ENGINEERING STORIES FROM THE INSIDE. FEATURING Asmaa Zaki, Software & System Test Engineer

MEET OUR TEAM- ENGINEERING STORIES FROM THE INSIDE. FEATURING Asmaa Zaki, Software & System Test Engineer In this edition of "Meet Our Team", we speak with Asmaa Zaki, Software & System Test Engineer at Engibex. With over 7 years of experience in embedded systems and automotive validation, Asmaa has built a career defined by curiosity, discipline, and a drive to make testing more...

Integrated Circuit (IC) Packaging Design Trends: Demands, Challenges, and the Role of EDA Tools

Integrated Circuit (IC) Packaging Design Trends: Demands, Challenges, and the Role of EDA Tools

Integrated Circuit (IC) Packaging Design Trends: Demands, Challenges, and the Role of EDA Tools Introduction As transistor scaling approaches its physical limits, the semiconductor industry is entering a new era where performance gains no longer come from shrinking nodes alone [1]. Instead, innovation is shifting to the package– the critical interface that binds multiple chips into a single,...

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